Unlocking Endurance with MEMS Technology:
Extending Relay lifespan by 1000x

THE PACE OF ELECTRIFICATION of virtually all systems has been accelerating. Electrification is now often the harbinger for integrating sensor and communication technologies within new systems. Moreover, there are a growing number of use cases and emerging business models based on enhanced intelligence and data gathering in previous analog spaces.

 

This renaissance of wireless technology necessitates an increase in capacity for both wireless/over-the-air (OTA) and conductive testing for semiconductor devices, subsystems, modules, and systems. The only way to achieve this higher capacity for testing the latest technologies in a reasonable time frame to meet demand is to increase testing throughput.